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Molybdenum Disc,Mo wafer

Product Details

Molybdenum wafer as heat-sinker for LED chips

  •  Made of pure molybdenum or MoCu
  •  Diameter from 2 inches to 8 inches (50.8 mm to 203.2 mm)
  •  Thickness more than 0.05 mm
  •  Surface as-rolled, polished or coated by PVD
  •  Laser cutting or mold-pressed
  •  Professional packing
  •  Tolerance, roughness, flatness and properties can be custom designed

 

Typical thermal properties

Pure Mo – W – MoCu – WCu – Semiconductor materials – Ceramics

 

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